Void free bonding of large silicon dice using gold-tin alloys
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (4) , 1128-1134
- https://doi.org/10.1109/33.62563
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
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