Film Characteristics of Low-Temperature Plasma-Enhanced Chemical Vapor Deposition Silicon Dioxide Using Tetraisocyanatesilane and Oxygen

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Abstract
Silicon dioxide films were deposited in a parallel-plate electrode RF plasma-enhanced chemical vapor deposition (PECVD) system using hydrogen-free tetraisocyanatesilane (TICS) and oxygen. The deposition parameters were varied systematically, and the films were characterized by measuring infrared spectra, density, etch rate, refractive index, and current-voltage (I–V) and capacitance-voltage (C–V) characteristics, as well as by examining their annealing behavior. At 300°C and a TICS partial pressure ratio of 20%, a water-free and hydroxyl-group-free SiO2 film was obtained. The film density, BHF etch rate, refractive index, resistivity, and dielectric constant were 2.3 g/cm3, 330 nm/min, 1.46, 7×1015 Ω·cm, and 3.6, respectively. The film quality degraded and, simultaneously, the film absorbed moisture from the atmosphere with decreasing deposition temperature; however, the quality can be improved by reducing TICS partial pressure. SiO2 films could be deposited even at 15°C, and had a resistivity of about 1013Ω·cm. Infrared measurements showed that SiO2 films deposited from TICS/O2 contained less absorbed water than those deposited from hydrogen-containing source materials at the same deposition temperature.

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