Tensile properties of Sn–Ag based lead-free solders and strain rate sensitivity
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- 1 February 2004
- journal article
- Published by Elsevier in Materials Science and Engineering: A
- Vol. 366 (1) , 50-55
- https://doi.org/10.1016/j.msea.2003.09.057
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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