Electromigration failure model: its application to W plug and Al-filled vias
- 1 May 1998
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 320 (1) , 45-51
- https://doi.org/10.1016/s0040-6090(97)01072-9
Abstract
No abstract availableKeywords
This publication has 6 references indexed in Scilit:
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- Electromigration in thin aluminum films on titanium nitrideJournal of Applied Physics, 1976
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- Inhibition of Electromigration Damage in Thin FilmsJournal of Vacuum Science and Technology, 1972