Processing and microwave characterization of multilevel interconnects using benzocyclobutene dielectric
- 1 January 1993
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 16 (7) , 714-719
- https://doi.org/10.1109/33.257862
Abstract
No abstract availableKeywords
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