On the current density dependence of electromigration in thin films
- 16 June 1988
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 107 (2) , K175-K179
- https://doi.org/10.1002/pssa.2211070259
Abstract
No abstract availableThis publication has 10 references indexed in Scilit:
- A model for conductor failure considering diffusion concurrently with electromigration resulting in a current exponent of 2Journal of Applied Physics, 1986
- Thermal grooving, thermotransport and electrotransport in doped and undoped thin gold filmsThin Solid Films, 1981
- Activation energy for electrotransport in thin aluminum films by resistance measurementsJournal of Physics and Chemistry of Solids, 1976
- Nucleation of voids and their growth during electromigrationJournal of Applied Physics, 1973
- Electromigration and metalization lifetimesJournal of Applied Physics, 1973
- Void Formation and Growth During Electromigration in Thin FilmsJournal of Applied Physics, 1971
- Electromigration and failure in electronics: An introductionProceedings of the IEEE, 1971
- Time-dependent void nucleation during electromigrationMaterials Science and Engineering, 1971
- On the current density dependence of electromigration in thin filmsProceedings of the IEEE, 1970
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969