Micromachined sensors using polysilicon sacrificial layer etching technology
- 17 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 127-130
- https://doi.org/10.1109/iedm.1994.383448
Abstract
Sensor assembly is one of the key technologies to improve the cost performance of silicon sensors. As a technology to achieve this aim, polysilicon sacrificial layer etching technology is presented. As its applications, a microdiaphragm pressure sensor with a reference pressure chamber and an integrated pyroelectric infrared sensor with a thermal isolated structure are also presented. Fabrication of a micro optical chopper is shown, and the future style of sensor devices is proposed.Keywords
This publication has 3 references indexed in Scilit:
- Silicon accelerometer with new thermal self-test mechanismPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- The coming opportunities in microsensor systemsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Integrated piezoresistive pressure sensor with both voltage and frequency outputSensors and Actuators, 1983