Laser-induced selective copper deposition on polyimide
- 21 November 1988
- journal article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 53 (21) , 2111-2113
- https://doi.org/10.1063/1.100292
Abstract
Laser irradiation of organometallic palladium compounds with an argon ion laser at 351 nm is used to selectively deposit catalytic amounts of palladium on polyimide. Subsequent immersion of the irradiated samples in an electroless copper solution results in copper deposition. Since a few monolayers of palladium are sufficient to catalyze the electroless copper process, fast writing speeds of several centimeters per second are obtained.Keywords
This publication has 7 references indexed in Scilit:
- Laser direct-write metallization in thin palladium acetate filmsJournal of Applied Physics, 1987
- LCVD of copper: Deposition rates and deposit shapesApplied Physics A, 1986
- Optical absorption of some polymers in the region 240–170 nmApplied Physics Letters, 1986
- Laser-induced selective deposition of micron-size structures on siliconJournal of Vacuum Science & Technology B, 1985
- Inorganic ion beam resist for additive plating of metallic interconnectsApplied Physics Letters, 1985
- Laser photodeposition of metal films with microscopic featuresApplied Physics Letters, 1979
- Vapor pressure measurements and gas chromatographic studies of the solution thermodynamics of metal .beta.-diketonatesInorganic Chemistry, 1972