Abstract
TiO2 thin films with a relative-dielectric constant of 20 were fabricated by electron cyclotron resonance (ECR) plasma oxidation of Ti thin films without substrate heating. The relative-dielectric constant was found to be constant for film thicknesses from 3.5 to 26 nm, and the maximum capacitance of 37 fF/µm2 was obtained for the thickness of 3.5 nm.