Residual stress determination by X-ray diffraction in tungsten thin films
- 1 March 1993
- journal article
- Published by Elsevier in Applied Surface Science
- Vol. 65-66, 99-105
- https://doi.org/10.1016/0169-4332(93)90642-o
Abstract
No abstract availableThis publication has 14 references indexed in Scilit:
- Tungsten phase transformation induced by low-fluence Ar irradiation in CuW multilayersMaterials Letters, 1992
- Stress, strain, and microstructure of sputter-deposited Mo thin filmsJournal of Applied Physics, 1991
- Residual stress measurements of thin aluminum metallizations by continuous indentation and x-ray stress measurement techniquesJournal of Materials Research, 1991
- Internal stress and structure of ultrahigh vacuum evaporated chromium and iron films and their dependence on substrate temperature and oxygen partial pressure during depositionThin Solid Films, 1990
- Internal Stresses and Adhesion Properties of Film/Substrate InterfacesMRS Proceedings, 1990
- Non-Destructive Assessment of Thin Film Stresses and Crystal Qualify of Silicon on Insulator Materials with Raman SpectroscopyMRS Proceedings, 1990
- Analysis of Stress Variations in Epitaxial Films Using Cathodoluminescence Microscopy and SpectroscopyMRS Proceedings, 1990
- Two original pieces of apparatus for the preparation of coatings using dynamic ion beam mixing: First applicationsSurface and Coatings Technology, 1989
- The influence of discharge current on the intrinsic stress in Mo films deposited using cylindrical and planar magnetron sputtering sourcesJournal of Vacuum Science & Technology A, 1985
- Adhesion, internal stress, microstructure and resistivity of thin alloy films of aluminium, copper and silverThin Solid Films, 1982