An X-ray diffraction (XRD) study of vapor deposited gold thin films on aluminum nitride (A1N) substrates
- 1 July 1997
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 304 (1-2) , 229-238
- https://doi.org/10.1016/s0040-6090(97)00220-4
Abstract
No abstract availableKeywords
This publication has 25 references indexed in Scilit:
- Thermodynamic considerations in the thick-film metallization of aluminium nitride substratesJournal of Materials Science Letters, 1990
- Characterization of Gold—Aluminum Nitride and Gold—Silicon Carbide InterfacesJournal of the American Ceramic Society, 1989
- X-ray diffraction studies of sputtered thin films of platinumJournal of Applied Physics, 1982
- Profile Fitting for Quantitative Analysis in X-Ray Powder DiffractionAdvances in X-ray Analysis, 1982
- Adhesion, phase morphology, and bondability of reacttvely-bonded and frit-bonded gold and silver thick-film conductorsJournal of Electronic Materials, 1974
- The Structure of Electroplated and Vapor-Deposited Copper FilmsJournal of Applied Physics, 1972
- Structure and Annealing Behavior of Metal Films Deposited on Substrates near 80 °K: I. Copper Films on GlassJournal of Vacuum Science and Technology, 1965
- Epitaxially induced strains in Cu2O films on copper single crystals—I X-ray diffraction effectsActa Metallurgica, 1962
- Measurement of Crystallite Size and Strain of Electroplated Films [Letter to the Editor]IBM Journal of Research and Development, 1960
- The Effect of Cold-Work Distortion on X-Ray PatternsJournal of Applied Physics, 1950