Amorphous W40Re40B20 diffusion barriers for /Al and /Cu metallizations
- 1 December 1993
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 236 (1-2) , 301-305
- https://doi.org/10.1016/0040-6090(93)90686-j
Abstract
No abstract availableKeywords
This publication has 19 references indexed in Scilit:
- Phase separations of amorphous CoW films during oxidation and reactions with Si and AlJournal of Applied Physics, 1989
- Tungsten–rhenium alloys as diffusion barriers between aluminum and siliconJournal of Vacuum Science & Technology A, 1988
- Properties of reactively sputtered Mo1?x O x filmsApplied Physics A, 1988
- Interactions of amorphous alloys with Si substrates and Al overlayersJournal of Applied Physics, 1986
- Sputtered W–N diffusion barriersJournal of Vacuum Science & Technology A, 1985
- Amorphous NiNW film as a diffusion barrier between aluminum and siliconThin Solid Films, 1985
- Failure temperature of amorphous Cu-Ta alloys as diffusion barriers in Al-Si contactsApplied Physics Letters, 1985
- Stability of amorphous Fe-W alloys in multilayer metallizations on siliconThin Solid Films, 1983
- Atomic interdiffusion in Au/amorphous NiNb/ semiconductor systemsThin Solid Films, 1983
- Amorphous Metallizations for High-Temperature Semiconductor Device ApplicationsIEEE Transactions on Industrial Electronics, 1982