A new multichip module using a copper polyimide multilayer substrate

This publication has 10 references indexed in Scilit:

• Internal thermal resistance of a multi-chip packaging design for VLSI-based systems
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
• Electrical Characteristics of Copper/Polyimide Thin-Film Multilayer Interconnects
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
• Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices
  Electronics Letters, 1987
• Multi-chip packaging technology for VLSI-based systems
  Published by Institute of Electrical and Electronics Engineers (IEEE) ,1987
• VLSI Packaging Technique Using Liquid-Cooled Channels
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1986
• Packaging Technology for the NEC SX Supercomputer
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1985
• A 9-GHz frequency divider using Si bipolar super self-aligned process technology
  IEEE Electron Device Letters, 1985
• Copper/polyimide Materials System for High Performance Packaging
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
• Gas Cooling Enhancement Technology for Integrated Circuit Chips
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
• IBM Multichip Multilayer Ceramic Modules for LSI Chips-Design for Performance and Density
  IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1980