Abstract
The influence of an oxidizing ambient on the structure and electrical characteristics of thin films of semi-insulating polysilicon (SIPOS) has been studied. It is shown that SIPOS films 135 nm thick can be completely oxidized to amorphous silicon dioxide after 24 h at 600 °C in wet oxygen. The midgap interface state density after oxidation and postmetallization anneal is 4×1010 cm−2 eV−1. We also show that this material is suitable for use as a low-temperature deposited gate dielectric for polycrystalline thin-film transistors.