Design Implications of Prow Formation During Electrical Contact Closure
- 1 June 1975
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 11 (2) , 110-114
- https://doi.org/10.1109/tphp.1975.1135053
Abstract
No abstract availableKeywords
This publication has 11 references indexed in Scilit:
- A 9ns Electrically Erasable Cmos Programmable Logic DevicePublished by Institute of Electrical and Electronics Engineers (IEEE) ,1988
- Ultrahigh vacuum system for the study of the mechanical and electrical properties of metallic surfacesJournal of Vacuum Science and Technology, 1974
- The Bonding Characteristics of Gold in Ultrahigh VacuumIEEE Transactions on Parts, Hybrids, and Packaging, 1974
- Electric contacts. II. Mechanics of closure for gold contactsJournal of Applied Physics, 1973
- The Wear of Electrodeposited GoldA S L E Transactions, 1968
- Processes of metal transfer and wearWear, 1964
- The lubrication of goldWear, 1963
- Metal Transfer and the Wedge Forming MechanismJournal of Applied Physics, 1963
- Wear, Friction, and Electrical Noise Phenomena in Severe Sliding SystemsA S L E Transactions, 1962
- Wear Debris in the Contact between Sliding MetalsJournal of Applied Physics, 1958