Packaging considerations for very high temperature microsystems
- 25 June 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2, 1139-1143
- https://doi.org/10.1109/icsens.2002.1037274
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Thick film hybrid packaging techniques for 500°C operationPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 6H-SiC pressure sensor operation at 600°CPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Operation of α(6H)-SiC pressure sensor at 500°CPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Characteristics of a hermetic 6H-SiC pressure sensor at 600 CPublished by American Institute of Aeronautics and Astronautics (AIAA) ,2001