Reduced copper diffusion in layered silicate/fluorinated polyimide (6FDA‐ODA) nanocomposites
- 26 February 2004
- journal article
- Published by Wiley in Journal of Applied Polymer Science
- Vol. 92 (3) , 1422-1425
- https://doi.org/10.1002/app.13676
Abstract
No abstract availableKeywords
This publication has 19 references indexed in Scilit:
- Chemical interaction, adhesion and diffusion properties at the interface of Cu and plasma-treated thiophene-based plasma polymer (ThioPP) filmsThin Solid Films, 2001
- Self-assembled near-zero-thickness molecular layers as diffusion barriers for Cu metallizationApplied Physics Letters, 2001
- The interface formation of copper and low dielectric constant fluoro-polymer: Plasma surface modification and its effect on copper diffusionJournal of Applied Physics, 1999
- Secondary ion mass spectrometry of a copper polyimide thin film packaging technologyJournal of Vacuum Science & Technology A, 1997
- Interactions at interface between Cu99Ti1 thin films and polyimideApplied Physics Letters, 1997
- Adhesion of poly(arylene ether benzimidazole) to copper and polyimidesJournal of Adhesion Science and Technology, 1996
- Formation of polyimide- Cu complexes: improvement of direct Cu-on-PI and PI-on-Cu adhesionJournal of Adhesion Science and Technology, 1995
- On the Nature of Polyimide-Clay Hybrid CompositesChemistry of Materials, 1994
- Synthesis and properties of polyimide–clay hybridJournal of Polymer Science Part A: Polymer Chemistry, 1993
- Adhesion and interface investigation of polyimide on metalsJournal of Adhesion Science and Technology, 1988