Fluage de fils de cuivre à structure bambou dans et hors du domaine de contrainte ou la diffusion contrôle la vitesse de déformation
- 1 January 1981
- journal article
- Published by Taylor & Francis in Philosophical Magazine A
- Vol. 43 (1) , 29-41
- https://doi.org/10.1080/01418618108239391
Abstract
No abstract availableKeywords
This publication has 13 references indexed in Scilit:
- The kinetics of grain boundary grooving in copperPublished by Elsevier ,2003
- Influence of some additional elements on the surface tension of copper at intermediate and high temperaturesSurface Science, 1977
- Device for microcreep experiments at high temperatureJournal of Physics E: Scientific Instruments, 1977
- Surface and grain boundary energies of silver at oxygen pressures lower than 10−15PaPhilosophical Magazine, 1975
- A comparison of theory with experiment for diffusion creep in metal foils and wiresMaterials Science and Engineering, 1969
- The effect of surface adsorption on zero creep measurements in iron-silicon alloysActa Metallurgica, 1966
- Interfacial free energy of copper-antimony alloysProceedings of the Royal Society of London. Series A. Mathematical and Physical Sciences, 1963
- CVIII. The deformation of silver at high temperatureJournal of Computers in Education, 1952
- The Deformation of Gold Wire at High TemperatureJournal of Applied Physics, 1951
- Diffusional Viscosity of a Polycrystalline SolidJournal of Applied Physics, 1950