Thermal Stress-Induced Grain Boundary Voiding and Notching in Narrow Al-Based Metallizations
- 1 January 1988
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
Grain boundary voiding has been identified as a diffusional creep mechanism that produces failure of narrow Al-based metallizations during thermal aging. It is considered to be a reliability concern for sub-micron metallizations because the resulting failure rate has been observed to be strongly line width dependent. This paper presents a theoretical model for stress-induced grain boundary voiding. The proposed model is shown to account for the experimentally observed temperature and time dependence of thermal aging-induced line failure data reported in the literature.Keywords
This publication has 8 references indexed in Scilit:
- Phase transformations in condensed systems revisited: Industrial applicationsMetallurgical and Materials Transactions A, 1996
- Analysis of thermal stress-induced grain boundary cavitation and notching in narrow Al-Si metallizationsApplied Physics Letters, 1988
- A model for stress-induced metal notching and voiding in very large-scale-integrated Al–Si (1%) metallizationJournal of Vacuum Science & Technology B, 1987
- Stress-induced grain boundary fractures in Al–Si interconnectsJournal of Vacuum Science & Technology B, 1987
- Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal historyIEEE Transactions on Electron Devices, 1987
- Plastic properties of thin films on substrates as measured by submicron indentation hardness and substrate curvature techniquesJournal of Materials Research, 1986
- Diffusive growth of grain-boundary cavitiesActa Metallurgica, 1981
- The growth of grain-boundary voids under stressPhilosophical Magazine, 1959