On-wafer characterization of thermomechanical properties of dielectric thin films by a bending beam technique
- 1 September 2000
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 88 (5) , 3029-3038
- https://doi.org/10.1063/1.1287771
Abstract
No abstract availableThis publication has 26 references indexed in Scilit:
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