Development of lead-free solder alloys of the Ge doped Sn-Ag-Bi system
- 1 January 1999
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- The design and properties of new, Pb-free solder alloysPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The design of new, Pb-free solder alloys with improved propertiesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- The Development and Commercialization of Lead-Free SolderingMRS Bulletin, 2001
- Metallurgy of low temperature Pb-free solders for electronic assemblyInternational Materials Reviews, 1995