Formation of thin GaN layer on Si (111) for fabrication of high-temperature metal field effect transistors (MESFETs)
- 30 June 2003
- journal article
- Published by Elsevier in Journal of Crystal Growth
- Vol. 253 (1-4) , 85-88
- https://doi.org/10.1016/s0022-0248(03)01020-0
Abstract
No abstract availableKeywords
This publication has 16 references indexed in Scilit:
- AlGaN/GaN Hetero Field-Effect Transistor for a Large Current OperationMaterials Science Forum, 2002
- A High-Power GaN-Based Field-Effect Transistor for Large-Current OperationPhysica Status Solidi (a), 2001
- High breakdown GaN HEMT with overlapping gate structureIEEE Electron Device Letters, 2000
- Characterization of a GaN Bipolar Junction Transistor after Operation at 300 for over 300 hJapanese Journal of Applied Physics, 1999
- Reliability of metal semiconductor field-effect transistor using GaN at high temperatureJournal of Applied Physics, 1998
- Reliability of GaN Metal Semiconductor Field-Effect Transistor at High TemperatureJapanese Journal of Applied Physics, 1998
- High temperature characteristics of AlGaN/GaN modulation doped field-effect transistorsApplied Physics Letters, 1996
- Temperature activated conductance in GaN/AlGaN heterostructure field effect transistors operating at temperatures up to 300 °CApplied Physics Letters, 1995
- Microwave performance of a 0.25 μm gate AlGaN/GaN heterostructure field effect transistorApplied Physics Letters, 1994
- Wide bandgap compound semiconductors for superior high-voltage unipolar power devicesIEEE Transactions on Electron Devices, 1994