Solid phase crystallization of amorphous Si1−xGex films deposited on SiO2 by molecular beam epitaxy
- 1 April 1995
- journal article
- research article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 77 (7) , 3042-3047
- https://doi.org/10.1063/1.358654
Abstract
We have investigated solid phase crystallization behavior of the molecular beam epitaxy grown amorphous Si1−xGex (x=0 to 0.53) alloy layers using x‐ray diffractometry and transmission electron microscopy (TEM). Our results show that the thermal budget for the full crystallization of the film is significantly reduced as the Ge concentration in the film is increased. In addition, we find that a pure amorphous Si film crystallizes with a strong (111) texture while that of the Si1−xGex alloy film crystallizes with a (311) texture suggesting that the solid phase crystallization mechanism is changed by the incorporation of Ge. TEM analysis of the crystallized film shows that the grain morphology of the pure Si is an elliptical and/or a dendrite shape with a high density of microtwins in the grains while that of the Si0.47Ge0.53 alloy is more or less equiaxed shape with a much lower density of defects. From these results, we conclude that the crystallization mechanism changes from a twin‐assisted growth mode to a random growth mode as the Ge concentration in the film is increased.This publication has 15 references indexed in Scilit:
- Initial crystallization stage of amorphous germanium filmsJournal of Applied Physics, 1992
- PMOS transistors in LPCVD polycrystalline silicon-germanium filmsIEEE Electron Device Letters, 1991
- CMOS circuits for peripheral circuit integrated poly-Si TFT LCD fabricated at low temperature below 600 degrees CIEEE Transactions on Electron Devices, 1991
- Polysilicon thin-film transistors with channel length and width comparable to or smaller than the grain size of the thin filmIEEE Transactions on Electron Devices, 1991
- Retardation of nucleation rate for grain size enhancement by deep silicon ion implantation of low-pressure chemical vapor deposited amorphous silicon filmsJournal of Applied Physics, 1989
- Characteristics of MOSFETs on large-grain polysilicon filmsIEEE Transactions on Electron Devices, 1988
- Large grain polycrystalline silicon by low-temperature annealing of low-pressure chemical vapor deposited amorphous silicon filmsJournal of Applied Physics, 1988
- Polycrystalline-silicon device technology for large-area electronicsIEEE Transactions on Electron Devices, 1986
- Crystallization of amorphous GeSi100− on SiO2Thin Solid Films, 1981
- Structure and Stability of Low Pressure Chemically Vapor‐Deposited Silicon FilmsJournal of the Electrochemical Society, 1978