Abstract
A new static technique for a very accurate measurement of charge, surface potential, low−frequency capacitance, interface charge, and interface state density in MOS structures is presented. A comparison with the conductance method is made. For a 〈111〉−oriented n−type silicon wafer, oxidized in dry oxygen and annealed in hydrogen, the distribution of the interface state density is shown over an energy range of 0.9 eV within the energy gap.