Tensile testing of thin-film materials on a silicon chip
- 24 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 111-117
- https://doi.org/10.1109/mhs.1996.563410
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Tensile Testing Of Epitaxial Silicon FilmsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- In Situ Tensile Strength Measurement Of Thick-film And Thin Film Micromacrined StructuresPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Fine frequency tuning in resonant sensorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial StressesJournal of Electronic Packaging, 1995
- Development of Mechanical Testing Machine for Microelements and Fracture Strength Evaluation of Single-Crystalline Silicon Microelements.TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A, 1994
- Measurement of fracture stress, young's modulus, and intrinsic stress of heavily boron-doped silicon microstructuresThin Solid Films, 1989
- Fracture testing of silicon microelements i n s i t u in a scanning electron microscopeJournal of Applied Physics, 1988
- Progress in the Development of a Mechanical Properties MicroprobeMRS Bulletin, 1986