Fundamental mechanisms of titanium nitride formation by d.c. magnetron sputtering
- 16 November 1992
- journal article
- Published by Elsevier in Surface and Coatings Technology
- Vol. 54-55, 338-342
- https://doi.org/10.1016/s0257-8972(09)90073-1
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Target and substrate surface reaction kinetics in magnetron sputtering of nitride coatingsThin Solid Films, 1990
- Dependence of microstructure of TiN coatings on their thicknessThin Solid Films, 1988
- Method for complex X-ray diffraction analysis of TiN coatingsCrystal Research and Technology, 1987
- Growth and properties of TiN and TiOxNy diffusion barriers in silicon on sapphire integrated circuitsThin Solid Films, 1987
- Reactive radio frequency sputter deposition of higher nitrides of titanium, zirconium, and hafniumJournal of Vacuum Science & Technology A, 1986
- TiNx coatings prepared by d.c. reactive magnetron sputteringThin Solid Films, 1986
- Structure and properties of TiN coatingsThin Solid Films, 1985
- Very high rate reactive sputtering of TiN, ZrN and HfNThin Solid Films, 1983
- Glow discharge mass spectrometry of sputtered tantalum nitrideJournal of Vacuum Science and Technology, 1981
- The Separation of Cold-Work Distortion and Particle Size Broadening in X-Ray PatternsJournal of Applied Physics, 1952