Influence of microstructure size on the plastic deformation kinetics, fatigue crack growth rate, and low-cycle fatigue of solder joints
- 1 September 1999
- journal article
- research article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (9) , 1062-1070
- https://doi.org/10.1007/s11664-999-0184-x
Abstract
No abstract availableKeywords
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