Interfacial reactions in Ag-Sn/Cu couples
- 1 November 1999
- journal article
- Published by Springer Nature in Journal of Electronic Materials
- Vol. 28 (11) , 1203-1208
- https://doi.org/10.1007/s11664-999-0158-z
Abstract
No abstract availableKeywords
This publication has 15 references indexed in Scilit:
- Interfacial reactions in molten Sn/Cu and molten In/Cu couplesMetallurgical and Materials Transactions B, 1997
- Activation energies of intermetallic growth of Sn-Ag eutectic solder on copper substratesJournal of Electronic Materials, 1997
- Prediction of interface reaction products between Cu and various solder alloys by thermodynamic calculationActa Materialia, 1997
- Phase equilibria of the ternary Ag-Cu-Ni system and the interfacial reactions in the Ag-Cu/Ni couplesJournal of Materials Science, 1996
- Solders in electronicsJournal of Materials Science, 1996
- Metallurgy of low temperature Pb-free solders for electronic assemblyInternational Materials Reviews, 1995
- A viable tin-lead solder substitute: Sn-Ag-CuJournal of Electronic Materials, 1994
- The effect of reflow process variables on the wettability of lead-free soldersJOM, 1993
- Issues in the replacement of lead-bearing soldersJOM, 1993
- On the determination of diffusion coefficients in multi-phase ternary couplesActa Metallurgica et Materialia, 1991