TEM in-situ observation of electromigration damage in Al-Cu strips I. Constant DC stressing
- 16 January 1981
- journal article
- research article
- Published by Wiley in Physica Status Solidi (a)
- Vol. 63 (1) , 363-370
- https://doi.org/10.1002/pssa.2210630147
Abstract
No abstract availableKeywords
This publication has 9 references indexed in Scilit:
- Microstructure of aluminium-copper thin films and its relation to electromigrationCzechoslovak Journal of Physics, 1980
- On the controversy about the direction of electrotransport in thin gold filmsApplied Physics Letters, 1975
- Electromigration-induced failures in thin-film Al-Cu conductorsJournal of Electronic Materials, 1974
- Activation Energy for Electromigration Failure in Aluminum Films Containing CopperJournal of Vacuum Science and Technology, 1972
- Inhibition of Electromigration Damage in Thin FilmsJournal of Vacuum Science and Technology, 1972
- STUDY OF FAILURE MECHANISMS IN Al–Cu THIN FILMS BY HIGH-VOLTAGE ELECTRON MICROSCOPYApplied Physics Letters, 1971
- The effect of copper additions on electromigration in aluminum thin filmsMetallurgical Transactions, 1971
- Reduction of Electromigration in Aluminum Films by Copper DopingIBM Journal of Research and Development, 1970
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970