In situ emissivity measurements to probe the phase transformations during rapid thermal processing Co silicidation
- 9 November 1992
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 61 (19) , 2296-2298
- https://doi.org/10.1063/1.108269
Abstract
Phase transformations during RTP Co silicidation on both crystalline and polycrystalline silicon have been monitored for the first time by in situ emissivity measurements at a wavelength of 2.4 μm. The method can be used to accurately control the silicidation process and the final silicide phase. It is demonstrated that factors influencing silicidation, such as background doping level and the degree of crystallinity of the substrate can be determined. Ex situ emissivity measurements as a function of wavelength show that an analyzing wavelength of 10 μm can be applied to further improve the probing sensitivity for all silicide phase transformations.Keywords
This publication has 10 references indexed in Scilit:
- Control of lateral overgrowth of TiSi2 and CoSi2 films in VLSI circuitsApplied Surface Science, 1991
- In Situ Wafer Emissivity Variation Measurement in a Rapid Thermal ProcessorMRS Proceedings, 1991
- Temperature Control and Temperature Uniformity During Rapid Thermal ProcessingMRS Proceedings, 1991
- Manufacturability issues related to transient thermal annealing of titanium silicide films in a rapid thermal processorIEEE Transactions on Semiconductor Manufacturing, 1991
- Tisi2 Thin Films Formed on Crystalline and Amorphous SiliconMRS Proceedings, 1990
- Formation of CoSi2 on amorphous silicon by RTAApplied Surface Science, 1989
- Interfacial reactions of cobalt thin films on BF+2 ion-implanted (001) siliconJournal of Applied Physics, 1988
- Nucleation of a new phase from the interaction of two adjacent phases: Some silicidesJournal of Materials Research, 1988
- A self-aligned CoSi2interconnection and contact technology for VLSI applicationsIEEE Transactions on Electron Devices, 1987
- A self-aligned cobalt silicide technology using rapid thermal processingJournal of Vacuum Science & Technology B, 1986