Integrated Hybrid Silicon Transmitters

Abstract
We review recent progress made on the hybrid silicon platform towards realizing an integrated WDM transmitter on silicon. Using ion implantation enhanced quantum well intermixing, four band gaps are integrated on a single chip and used to demonstrate a DFB laser-EAM array. The latest results on design changes to improve Mach-Zender and EA modulator performance are also described and the prospects for fabricating an integrated terabit per second transmitter on silicon are presented.

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