Effect of thermal annealing of Ni/Au ohmic contact on the leakage current of GaN based light emitting diodes

The effect of thermal annealing on current–voltage properties of GaN light emitting diodes (LEDs) has been studied. At annealing temperatures above $\text{700\hspace{0.05em}°}\mathrm{C},$ the $\mathrm{p–n}$ junction of the diodes became very leaky and Ga-contained metallic bubbles were observed on the surface of Ni/Au p-ohmic contact. Transmission electron microscopy and energy dispersive x-ray spectrometer studies revealed that these metallic bubbles resided directly on top of the threading dislocations in GaN and both Ni and Au were indiffused into the LED structure along the cores of the TDs. The conducting paths formed by the metal containing dislocation cores are believed to be the cause for the observed short circuit behavior of $\mathrm{p–n}$ junctions at high annealing temperatures.