Smart-Cut: A New Silicon On Insulator Material Technology Based on Hydrogen Implantation and Wafer Bonding*1
- 1 March 1997
- journal article
- Published by IOP Publishing in Japanese Journal of Applied Physics
- Vol. 36 (3S) , 1636-1641
- https://doi.org/10.1143/jjap.36.1636
Abstract
No abstract availableKeywords
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