Selectively dry-etched n/sup +/-GaAs/N-InAlAs/InGaAs HEMTs for LSI
- 1 May 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Electron Device Letters
- Vol. 11 (5) , 230-232
- https://doi.org/10.1109/55.55259
Abstract
High-speed n-InAlAs/InGaAs HEMT large-scale integrated circuits must have uniform device parameters. A selectively dry-etched n/sup +/-GaAs/N-InAlAs/InGaAs HEMT which has a very uniform threshold voltage is discussed. Despite the high dislocation density at the n/sup +/-GaAs layer, its performance is excellent. For a gate length of 0.92 mu m, the maximum transconductance of the HEMT is 390 mS/mm. The measured current-gain cutoff frequency is 23.7 GHz, and the maximum frequency of oscillation is 75.0 GHz. The standard deviation of the threshold voltage across a 2-in wafer is as low as 13 mV.<>Keywords
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