Industrial fabrication technology for CMOS infrared sensor arrays
- 22 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 1, 205-208
- https://doi.org/10.1109/sensor.1997.613619
Abstract
We report a new technology for the industrial fabrication of CMOS infrared sensor arrays on suspended membranes. Gold lines made with the bumping technology of the IC manufacturer are used to thermally separate the sensor pixels. Further, the buckling problem of CMOS dielectric membranes was solved by finding an oxynitride passivation suitable for the fabrication of low-stress membranes. Finally, the influence of bulk crystal defects on the lateral back mask underetching was studied.Keywords
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