First-principle dynamical electronic characteristics of Al electromigration in the bulk, surface, and grain boundary
- 26 March 2003
- journal article
- research article
- Published by American Physical Society (APS) in Physical Review B
- Vol. 67 (11) , 115124
- https://doi.org/10.1103/physrevb.67.115124
Abstract
Formulas for the driving force of electromigration have been presented using concepts of the tension density, the external force density, and the effective charge tensor density. The “dynamic” wind charge tensor density has been revealed over and above the conventional “static” wind charge tensor density We have demonstrated the application of the concepts to electromigration reliability problems of ultralarge-scale integration devices where extremely high current densities should be maintained through ultrathin film interconnects. Quantum mechanical wave-packet propagation of an Al atom has been examined in some models of thin Al lines which contain atomic defects, using the first-principle electronic structure calculations under the periodic boundary condition. The dynamical electronic properties by our simulation have demonstrated the characteristic features of the in the course of the Al electromigration in the bulk, surface, and grain boundary.
Keywords
This publication has 29 references indexed in Scilit:
- Electromigration failure model: its application to W plug and Al-filled viasThin Solid Films, 1998
- Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnectsJournal of Applied Physics, 1997
- Electromigration and IC InterconnectsMRS Bulletin, 1993
- In situscanning-tunneling-microscopy studies of early-stage electromigration in AgPhysical Review B, 1993
- Electromigration in thin aluminum films on titanium nitrideJournal of Applied Physics, 1976
- Electromigration in thin gold films on molybdenum surfacesThin Solid Films, 1975
- The force on a moving charge in an electron gasJournal of Physics C: Solid State Physics, 1973
- HILLOCKS AS STRUCTURAL MARKERS FOR ELECTROMIGRATION RATE MEASUREMENTS IN THIN FILMSApplied Physics Letters, 1971
- Electromigration—A brief survey and some recent resultsIEEE Transactions on Electron Devices, 1969
- Sur l'electrolyse des alliages metalliquesJournal of Physics and Chemistry of Solids, 1962