Plasma-controlled deposition of GaAs and GaAsP by metalorganic chemical vapor deposition

Abstract
Alternating layers of GaAs and GaAsxP1−x with varying x were grown at low temperatures using a plasma‐enhanced metalorganic chemical vapor deposition process. A remote plasma localized to a region above the substrate was used to selectively dissociate arsine and phosphine and allow GaAs and GaAsxP1−x to be grown at low temperatures where no appreciable deposition takes place without the plasma. This made it possible to use the plasma as a switch to turn deposition on and off. The technique was used to produce very abrupt multiple layers of GaAs and GaAsxP1−x by changing gases when the plasma was off.

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