Temperature profile effects in accelerated thermal cycling of SnPb and Pb-free solder joints
- 1 February 2006
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 46 (2-4) , 574-588
- https://doi.org/10.1016/j.microrel.2005.01.008
Abstract
No abstract availableThis publication has 9 references indexed in Scilit:
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