Study of nanocrystalline Ta(N,O) diffusion barriers for use in Cu metallization
- 31 January 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 33 (1-4) , 269-275
- https://doi.org/10.1016/s0167-9317(96)00054-8
Abstract
No abstract availableKeywords
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