Aluminum dual damascene interconnects with low-κ intra/inter-level dielectric for reduced capacitance and low cost
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 146-148
- https://doi.org/10.1109/iitc.1998.704775
Abstract
Aluminum dual damascene interconnects using a low dielectric constant (low-/spl kappa/) material as intra/inter level dielectric have been successfully demonstrated. The low-/spl kappa/ material has led to significant reduction in both intra-level and inter-level capacitance in the dual damascene Al interconnect structures. In addition, low via resistance and good interconnect reliability characteristics have been observed in the low-cost Al/low-/spl kappa/ dual damascene interconnects.Keywords
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