On the log-normal distribution of electromigration lifetimes
- 1 July 1979
- journal article
- letter
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 50 (7) , 5062-5064
- https://doi.org/10.1063/1.325611
Abstract
It has been shown that a normal temperature distribution within a sample set can produce a log‐normal failure rate in electromigration experiments if it is assumed that the equation tf=Aj−n exp(Ef/kT) holds for individual stripe lifetimes. It has also been pointed out that if σ’s determined under accelerated‐stress conditions are used to predict failure under normal‐use conditions, incorrect failure rates may result. It has also been demonstrated that most of the σ’s observed in accelerated tests can be attributed to variations in temperature.This publication has 8 references indexed in Scilit:
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- Electromigration Failure in A1 Thin Films under Constant and Reversed DC PoweringIEEE Transactions on Reliability, 1974
- Electromigration testing—A current problemMicroelectronics Reliability, 1974
- On the spread of time-to-failure measurements in thin metallic filmsThin Solid Films, 1973
- Electromigration and metalization lifetimesJournal of Applied Physics, 1973
- Statistical Metallurgical Model for Electromigration Failure in Aluminum Thin-Film ConductorsJournal of Applied Physics, 1971
- Dependence of Electromigration-Induced Failure Time on Length and Width of Aluminum Thin-Film ConductorsJournal of Applied Physics, 1970
- Electromigration Damage in Aluminum Film ConductorsJournal of Applied Physics, 1970