Textures of thin copper films
- 1 October 1998
- journal article
- Published by Springer Nature in Journal of Materials Research
- Vol. 13 (10) , 2962-2968
- https://doi.org/10.1557/jmr.1998.0405
Abstract
The textures of thin copper films were determined quantitatively by measuring (111) pole figures with x-ray diffraction. Measurements were performed on a variety of samples, differing in copper film thickness and deposition technique, diffusion barrier material, and the presence or absence of a cap layer. Texture changes due to an annealing treatment were also recorded and correlated with stress measurements by the wafer-curvature technique. It is found that the deposition method (PVD vs CVD) has a strong effect on texture, barrier layer effects range from negligible to significant depending on the barrier material, and the effect of a cap layer is insignificant.Keywords
This publication has 10 references indexed in Scilit:
- Effects of barrier layer and processing conditions on thin film Cu microstructureJournal of Electronic Materials, 1995
- Thermal strain and stress in copper thin filmsThin Solid Films, 1995
- Texture and microstructure of thin copper filmsJournal of Electronic Materials, 1993
- The microstructure, mechanical stress, texture, and electromigration behavior of Al-Pd alloysJournal of Electronic Materials, 1993
- Relationship between texture and electromigration lifetime in sputtered AI-1% Si thin filmsJournal of Electronic Materials, 1993
- Electromigration in vacuum evaporated Cu filmsApplied Surface Science, 1993
- Stress and anisotropy effects in the interfacial reactions of Al and TiNxThin Solid Films, 1993
- Texture Development in Thin Metallic FilmsTexture, Stress, and Microstructure, 1991
- Effect of texture and grain structure on electromigration in Al-0.5%Cu thin filmsThin Solid Films, 1981
- A Direct Method of Determining Preferred Orientation of a Flat Reflection Sample Using a Geiger Counter X-Ray SpectrometerJournal of Applied Physics, 1949