Numerical Modelling and Materials Characterisation for Integrated Micro Electro Mechanical Systems
- 1 January 1995
- book chapter
- Published by Springer Nature
Abstract
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This publication has 9 references indexed in Scilit:
- Ultrasound barrier based on packaged micromachined membrane resonatorsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2005
- Determination of the heat capacity of CMOS layers for optimal CMOS sensor designSensors and Actuators A: Physical, 1995
- Aspects of intelligent sensor reconfigurationSensors and Actuators A: Physical, 1995
- Determination of the thermal conductivity of CMOS IC polysiliconSensors and Actuators A: Physical, 1994
- A Microstructure For Measurement Of Thermal Conductivity Of Polysilicon Thin FilmsJournal of Microelectromechanical Systems, 1992
- The In-Situ Measurement of Biaxial Modulus and Residual Stress of Multi-Layer Polymeric Thin FilmsMRS Proceedings, 1990
- Verification of FEM analysis of load-deflection methods for measuring mechanical properties of thin filmsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1990
- Microfabricated structures for the i n s i t u measurement of residual stress, Young’s modulus, and ultimate strain of thin filmsApplied Physics Letters, 1987
- Analysis and Simulation of Semiconductor DevicesPublished by Springer Nature ,1984