Stresses in passivated lines from curvature measurements
- 14 June 2000
- journal article
- Published by Elsevier in Acta Materialia
- Vol. 48 (10) , 2429-2434
- https://doi.org/10.1016/s1359-6454(00)00077-x
Abstract
No abstract availableKeywords
This publication has 10 references indexed in Scilit:
- Analysis of average thermal stresses in passivated metal interconnectsJournal of Applied Physics, 1999
- Thermoelastic analysis of periodic thin lines deposited on a substrateJournal of the Mechanics and Physics of Solids, 1999
- Evolution of stresses in passivated and unpassivated metal interconnectsJournal of Materials Research, 1998
- Stresses, curvatures, and shape changes arising from patterned lines on silicon wafersJournal of Applied Physics, 1996
- Analysis Of Stresses And Strains In Passivated Metal LinesMRS Proceedings, 1996
- The Effect of the Passivation Material on the Stress and Stress Relaxation Behavior of Narrow Al-Si-Cu LinesMRS Proceedings, 1996
- Characteristics of thermal stresses in Al(Cu) fine lines. II. Passivated line structuresJournal of Applied Physics, 1995
- X-Ray Strain Measurements in Fine-Line Patterned AL-CU FilmsMRS Proceedings, 1994
- Measurement of thermal stress and stress relaxation in confined metal lines. I. Stresses during thermal cyclingJournal of Applied Physics, 1993
- The tension of metallic films deposited by electrolysisProceedings of the Royal Society of London. Series A, Containing Papers of a Mathematical and Physical Character, 1909