Forming Feedthroughs in Laser-Drilled Holes in Semiconductor Wafers by Double-Sided Sputtering
- 1 March 1982
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 5 (1) , 171-180
- https://doi.org/10.1109/tchmt.1982.1135926
Abstract
No abstract availableThis publication has 8 references indexed in Scilit:
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