Microelectronics cooling and SEMI-THERM: a look back
- 17 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 14, 1-16
- https://doi.org/10.1109/stherm.1994.289000
Abstract
No abstract availableThis publication has 79 references indexed in Scilit:
- Thermal dissipation characteristics of a non-hermetic metal dual in-line packagePublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Thermal characterization of a 149-lead VLSI package with heat sinkPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Junction-to-case thermal resistance-still a myth?Published by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Package thermal resistance model dependency on equipment designPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- The use of thermochromic liquid crystals in research applications, thermal mapping and non-destructive testingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Liquid crystal imaging for temperature measurement of electronic devicesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Precisional comparison of surface temperature measurement techniques for GaAs ICsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Theta /sub JC/ characterization of chip packages-justification, limitations, and futurePublished by Institute of Electrical and Electronics Engineers (IEEE) ,1989
- Low speed wind tunnel testingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1988
- Factors affecting semiconductor device thermal resistance measurementsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1988