Prebreakdown and breakdown effects in AlGaN/GaN heterostructure field effect transistors
- 23 March 1998
- journal article
- research article
- Published by AIP Publishing in Applied Physics Letters
- Vol. 72 (12) , 1475-1477
- https://doi.org/10.1063/1.120597
Abstract
Prebreakdown and breakdown effects under high electric fields in AlGaN/GaN heterojunction field effect transistors were studied. In the subthreshold regime, at large drain-to-source voltages along with the gate leakage current, a significant source current was measured. For a wide range of gate-to-source bias voltages in OFF and ON regimes, the breakdown voltage was limited by a rapid buildup of the source current, rather than a process dominated by gate leakage.
Keywords
This publication has 15 references indexed in Scilit:
- AlGaN-GaN heterostructure FETs with offset gatedesignElectronics Letters, 1997
- AlGaN/GaN HEMTs grown on SiC substratesElectronics Letters, 1997
- Very high breakdown voltage and large transconductance realized on GaN heterojunction field effect transistorsApplied Physics Letters, 1996
- Suppression of leakage currents and their effect on the electrical performance of AlGaN/GaN modulation doped field-effect transistorsApplied Physics Letters, 1996
- 75 Å GaN channel modulation doped field effect transistorsApplied Physics Letters, 1996
- Theoretical analysis of HEMT breakdown dependence on device design parametersIEEE Transactions on Electron Devices, 1991
- Drain avalanche breakdown in gallium arsenide MESFET'sIEEE Transactions on Electron Devices, 1988
- Microwave power double-heterojunction HEMT'sIEEE Transactions on Electron Devices, 1986
- Light emission and burnout characteristics of GaAs power MESFET'sIEEE Transactions on Electron Devices, 1978
- 4-GHz 15-W power GaAs MESFETIEEE Transactions on Electron Devices, 1978