A flip-chip MMIC design with CPW technology in the W-band
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- Vol. 2 (0149645X) , 525-528
- https://doi.org/10.1109/mwsym.1998.705047
Abstract
We designed and fabricated a W-band flip-chip MMIC amplifier with a coplanar waveguide (CPW) transmission line using 0.15 /spl mu/m InGaP-InGaAs HEMT technology. In addition, we present a test structure for obtaining an accurate flip-chip CPW line model, and demonstrate a two-stage flip-chip MMIC amplifier with a gain of 12 dB at 79 GHz to validate this model.Keywords
This publication has 8 references indexed in Scilit:
- A novel millimeter-wave IC on Si substrate using flip-chip bonding technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- A flip chip bonding technology using gold pillars for millimeter-wave applicationsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- 60 GHz flip-chip assembled MIC design considering chip-substrate effectPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Reducing the effects of the mounting substrate on the performance of GaAs MMIC flip chipsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Compact monolithic coplanar 94 GHz front endsPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1997
- Advantages of flip chip technology in millimeter-wave packagingPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1997
- Millimeter-wave performance of chip interconnections using wire bonding and flip chipPublished by Institute of Electrical and Electronics Engineers (IEEE) ,1996
- Evaluation of quasi-static matrix parameters for multiconductor transmission lines using Galerkin's methodIEEE Transactions on Microwave Theory and Techniques, 1994