Thermal stability of cobalt silicide thin films on Si(100)
- 15 July 1993
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 74 (2) , 1035-1039
- https://doi.org/10.1063/1.354950
Abstract
No abstract availableThis publication has 20 references indexed in Scilit:
- Effect of fluorine incorporation on the thermal stability of PtSi/Si structureIEEE Transactions on Electron Devices, 1993
- Self-aligned silicide technology for ultra-thin SIMOX MOSFETsIEEE Transactions on Electron Devices, 1992
- Modeling of agglomeration in polycrystalline thin films: Application to TiSi2 on a silicon substrateJournal of Applied Physics, 1992
- Formation of self-aligned cobalt silicide in normal flow nitrogen furnaceThin Solid Films, 1992
- Formation of PtSi-contacted p+n shallow junctions by BF+2 implantation and low-temperature furnace annealingJournal of Applied Physics, 1991
- The use of disposable double spacer and self-aligned cobalt silicide for LDD MOSFET fabricationIEEE Electron Device Letters, 1991
- Characterization and implementation of self-aligned TiSi/sub 2/ in submicrometer CMOS technologyIEEE Transactions on Electron Devices, 1991
- Agglomeration of Cobalt Silicide FilmsMRS Proceedings, 1990
- A study of the leakage mechanisms of silicided n+/p junctionsJournal of Applied Physics, 1988
- High Temperature Process Limitation on TiSi2Journal of the Electrochemical Society, 1986