Solder bumping methods for flip chip packaging
- 22 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- No. 05695503,p. 240-247
- https://doi.org/10.1109/ectc.1997.606176
Abstract
A survey of the flip chip industry was undertaken to investigate the various solder bumping technologies reported in the literature. The methods are classified into four main deposition categories: vapor phase, liquid phase, solid phase, and electrochemical. Theoretical and empirical evaluations of these techniques, based on work at MCNC and Unitive Electronics Inc., are provided.Keywords
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